Core Processes of Printer Chip Reverse Engineering---Layer-by-layer Stripping and Micro-imaging

Core Processes of Printer Chip Reverse Engineering---Chip Pretreatment

Toner chip reverse engineering is a technology that strips the chip materials layer by layer through chemical methods and analyzes the internal structure of the chip using a scanning electron microscope (SEM). 

Attackers can infer the chip's functions and design code by extracting the circuit layout and gate - level netlist. This method is usually used to crack the design logic of the chip.

It is essentially a technology that reverse - deduces the printer chip design logic through physical deconstruction + micro - analysis, with a dual nature of “technical research” and “security risks”. 

This series article will help you understand this technology more comprehensively from four dimensions: core processes, key objectives, application scenarios (legal vs illegal), and protection methods:

Core Processes of Printer Chip Reverse Engineering (from “disassembly” to “deduction”)

The “chemical stripping + SEM analysis” is the core step of physical deconstruction, but a complete reverse requires the cooperation of multiple links. It can be divided into 5 steps specifically:

Layer - by - layer Stripping and Micro - imaging

The chip's circuit is “stacked in layers” (such as metal interconnection layers, transistor layers, doping layers). It is necessary to expose each layer of structure through chemical etching (removing materials layer by layer with specific reagents) or ion milling (high - precision physical stripping);

Then, use a scanning electron microscope (SEM) or transmission electron microscope (TEM) to perform ultra - high - resolution imaging (with a resolution reaching the nanometer level) on each layer to obtain the circuit topology of this layer (similar to “taking maps layer by layer”).

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